IPC J-STD-033D Handling of Moisture sensitive devices

114.00

IPC J-STD-033D Handling of Moisture sensitive devices

SKU: J-STD-033 HARD COPY Category: Tag:

Description

IPC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow and Process Sensitive Devices

Standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components to help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented.

32 pages. Released April 2018.